ISTFA Home      Exposition      To Register      ASM Homepage

			Back to "Symposium" Search	Back to Main Search
Session 6: Circuit Edit for FA, FI, and Debug
Location: Meeting Room J1-J2 (San Jose McEnery Convention Center)
(Please check final room assignments on-site).
Session Description: The Circuit Edit session focuses primarily on backside techniques. One paper addresses the challenge of making ohmic contact to diffusions, and two papers describe backside edit methodologies that maintain flat trench floors, allow accurate navigation and mill high aspect ratio vias. The final oral paper addresses the unique concept of temperature control during FIB milling and deposition, finding that sticking coefficient of precursor chemistries dominates reaction rate. In addition to the oral papers, three poster papers are presented that address CAD-less navigation, nanomechanical characterization and a wet-etch technique used to compliment FIB milling.
Editors:	Mr. Nicholas Antoniou Private Consultant, Peabody, MA Marsha Abramo Independent Consultant, New York Christian Boit TUB Berlin University of Technology, Berlin, Germany Ted Lundquist DCG Systems, Fremont, CA Mr. Alan Street inscopelabs, San Diego, CA Mr. Kendall Scott Wills Independent Consultant, Sugar Land, TX
Session Chair:	Mr. Alan Street inscopelabs, San Diego, CA
3:00 PM	SYMP057.3		Contacting Diffusion with FIB for Backside Circuit Edit - Procedures and Material Analysis
3:25 PM	SYMP057.4		Novel and Practical Method of Through Silicon FIB Editing of SOI Devices
3:50 PM	SYMP057.5		The Joy of SOI: As Viewed from a Backside FIB Perspective