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Wednesday, November 9, 2005 - 2:40 PM
SYMP0513.6
Root Cause Analyses of Metal Bridging for Copper Damascene Process
Z. Song, IBM, Hopewell Junction, NY; S. P. Neo, S. K. Loh, C. K. Oh, Chartered Semiconductor Mfg Ltd, Singapore, Singapore; C. C. L. Sin, StockerYale, Singapore, Singapore
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