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| Session 13: Failure Analysis Process | ||||
| Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: The Failure Analysis Process session covers the overall approach to failure analysis. The papers in this session cover topics including analysis strategies for low failure rates, contamination, metal bridging defects in copper damascene processes, and lead-free solider joints. | ||||
| Editors: | Mr. Tracy Myers ON Semiconductor, Gresham, OR Mr. Richard McClelland Philips Semiconductors, San Jose, CA Tim McGrady Atmel Corp., Colorado Springs, CO Mr. Tom Paquette Insight Analytical Labs, Colorado Springs, CO Mr. Chris Richardson Abound Solar, Fort Collins, CO | |||
| Session Chair: | Mr. Tracy Myers LSI Logic Corporation, Gresham, OR | |||
| 2:15 PM | SYMP0513.5 | Studies on A Failure Analysis Flow of Surface Contamination/Corrosion/Underetch on Microchip Al Bondpads in Wafer Fabrication | ||
| 2:40 PM | SYMP0513.6 | Root Cause Analyses of Metal Bridging for Copper Damascene Process | ||
| 3:05 PM | SYMP0513.7 | Strategies for the Analysis of Single Unit Failures in Low Failure Rate Applications | ||
| 3:30 PM | SYMP0513.8 | Failure Analysis Techniques for Lead Free Solder Joints | ||