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Wednesday, November 9, 2005 - 5:05 PM
SYMP0515.4
3-D Defect Characterization using Plan View and Cross-Sectional TEM/STEM Analysis
T. J. Stark, Materials Analytical Services, Raleigh, NC; P. E. Russell, North Carolina State University, Raleigh, NC; C. Nevers, TriQuint Semiconductor, Hillsboro, OR
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