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| Session 15: Sample Preparation 1 | ||||
| Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: The Sample Preparation session covers those processes and techniques necessary prior to either fault isolation or physical analysis, and enable these subsequent analysis steps. The seven papers in this session cover topics including renewal of package and die connections to improve contact for characterization and analysis, Flip chip underfill removal using RIE that prevents damage to copper metallization, cross-sectioning of die mounted in ceramic packages, an alternative method of removing die from ceramic packages, a method to nondestructively investigate passivation damage using backside analysis, application and results of an automated cross-sectioning tool, and the application of an in-situ lift-out tool that adds flexibility to TEM sample preparation. | ||||
| Editors: | Mr. Brennan Davis AMD, Austin, TX Ray Haythornwaite, Ph.D. Semiconductor Insights, Kanata, Canada Mr. Ron Hylton Maxim Integrated Products, Beaverton, OR Mr. Mark Kimball Maxim Integrated Products, Hillsboro, OR Mr. Mike Jr. Santana Advanced Micro Devices, Austin, TX Dr. Kei-Wean Yang Tektronix Inc., Beaverton, OR | |||
| Session Chair: | Mr. Ron Hylton Maxim Integrated Products, Beaverton, OR | |||
| 4:15 PM | SYMP0516.1 | Improvement of Electrical Contacts in the Failure Analysis for In-Depth Characterization of Structures and Products | ||
| 4:40 PM | SYMP0516.3 | The Versatile Application for In-situ Lift-out TEM Sample Preparation by Micromanipulator and Nanomotor | ||
| 5:05 PM | SYMP0516.4 | Failure Analysis of Electronic and Microelectronic Components with a New Automatic Target Preparation System | ||
| 5:30 PM | SYMP0516.6 | Investigation of Passivation Damage from the Backside | ||