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Session 8: Optical Techniques 1 | ||||
Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
(Please check final room assignments on-site). | ||||
Session Description: This session examines the tools, methods and application of failure analysis using optical techniques. Optical techniques encompass a wide variety of methods for localizing failures, ranging from traditional techniques such as OBIRCH/TIVA to newer methods such as resistive interconnect localization and soft defect localization. This session also includes optically-based waveform gathering techniques, such as LVP and PICA. | ||||
Editors: | Dr. Aaron Falk OptoMetrix, Inc, Renton, WA Mr. Dan J. Bodoh Freescale Semiconductor, Austin, TX Dr. Michael Bruce Independant, TX Dr. J. Joseph Clement Sandia National Laboratories, Albuquerque, NM Steven Kasapi NVIDIA, Santa Clara, CA Dr. Philippe Perdu CNES - French Space Agency, Toulouse, France Dr. Peilin Song IBM, Yorktown Heights, NY | |||
Session Chairs: | Dr. J. Joseph Clement Sandia National Laboratories, Albuquerque, NM Dr. Michael Bruce Independant, TX | |||
8:00 AM | SYMP0510.5 | Dynamic Laser Delay Variation Mapping (DVM) Implementations and Applications | ||
8:25 AM | SYMP0510.6 | Soft Defect Localization Techniques without a Synchronization Signal to the Laser Scanning Module | ||
8:50 AM | SYMP0510.7 | Guideline for Interpreting IR Laser Stimulation Signal on Semiconductors Materials and Improving Failure Analysis Flow | ||
9:15 AM | SYMP0510.8 | Lock-In Assisted Soft Defect Localization (LIA-SDL) and its Application in Scan Shift Problem |