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| Session 22: System Level 2/Packaging 2/SPM 2 | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: This session covers System Level Analysis, Package Level Analysis, and Scanned Probe Microscope Techniques. This combined session includes talks on contamination outgassing, high speed camera methodologies, discontinuity failures, contact defect isolation, and an FIB method for extending the life of probe tips. | ||||
| Editors: | Mr. Jeff Birdsley Dell Inc., ROUND ROCK, TX Mr. Roger Bjork Dell, Round Rock, TX Rajen Dias Intel Corporation, Chandler, AZ Mr. Ray Harrison Texas Instruments, Dallas, TX Mr. Jeff Hartsell Dell Inc., ROUND ROCK, TX Mr. Phil Kaszuba IBM Microelectronics, Essex Junction, VT Mr. Robert Knoell Visteon Corporation, Dearborn, MI Mr. Michael Lane Intel, Hillsboro, OR Mr. Daren T. Slee Exponent, Inc., Menlo Park, CA Dr. James Slinkman IBM Microelectronics, Essex Junction Mr. Jan Swart Exponent, Phoenix, AZ | |||
| Session Chair: | Mr. Jeff Birdsley Dell Inc., ROUND ROCK, TX | |||
| 1:00 PM | SYMP0522.2 | System Failures Due to Contamination Out Gassing | ||
| 1:25 PM | SYMP0522.3 | Using High Speed Camera Metrology In Support of Failure Analysis and Product Development | ||
| 1:50 PM | SYMP0522.4 | Integration of Package Analysis Tools to Solve Discontinuity Failures | ||
| 2:15 PM | SYMP0522.5 | The Study and Methodology of Defects Isolation For Contacts of Non-Isolated Active Region on New Logic Designs | ||
| 2:40 PM | SYMP0522.6 | Focused Ion Beam Method for Reconditioning Worn Tungsten Atomic Force Probe Tips | ||