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| Session 23: Sample Preparation 2 | ||||
| Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: This session is a continuation of Sample Preparation 1. | ||||
| Editors: | Mr. Brennan Davis AMD, Austin, TX Ray Haythornwaite, Ph.D. Semiconductor Insights, Kanata, Canada Mr. Ron Hylton Maxim Integrated Products, Beaverton, OR Mr. Mark Kimball Maxim Integrated Products, Hillsboro, OR Mr. Mike Jr. Santana Advanced Micro Devices, Austin, TX Dr. Kei-Wean Yang Tektronix Inc., Beaverton, OR | |||
| Session Chair: | Mr. Mark Kimball Maxim Integrated Products, Hillsboro, OR | |||
| 3:25 PM | SYMP0524.1 | An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates | ||
| 3:50 PM | SYMP0524.2 | Sectioning Integrated Circuit Ceramic Packages for Improved Electromigration Failure Analysis | ||