J. Zhou, W. Zheng, T. Lee, Samsung Semiconductor China R&D Co. Ltd., Suzhou, Jiangsu Province, China

Summary: A new MCP decapsulation technology combining mechanical polishing with chemical etching is introduced. This new technology can remove the upper die quickly without damaging the bottom die due to using KOH and TMAH. The technology application and relative process are presented. The factors that affect the KOH and TMAH etching speed are studied. The difference between KOH etching and TMAH etching is discussed.