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| Session 18: Package Level Analysis 2 | ||||
| Location: Ballroom A (Renaissance Austin Hotel) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: This session is a continuation of Session 7: Package Level Analysis 1. | ||||
| Editor: | Dr. Deepak Goyal Intel Corporation, Chandler, AZ | |||
| Session Chairs: | Dr. Deepak Goyal Intel Corporation, Chandler, AZ Ms Zezhong Fu Intel Corporation, Chandler, AZ | |||
| 3:15 PM | Accelerated Corrosion of Printed Circuit Boards Due to High Levels of Reduced Sulfur Gasses in Industrial Environments | |||
| 3:40 PM | Fine MCP Decapsulation Technology Development | |||
| 4:05 PM | Correlation Study of Delamination Gap Detection Capability of SAM and Cross Section/SEM Analysis | |||
| 4:30 PM | Measurement Techniques for Thermally Induced Warpage to Predict Ball Grid Array Package-on-Package Solder Compatibility | |||