X. Chen, Semiconductor Manufacturing International (Shanghai) Corp, Shanghai, China; T. Ge, L. Tsou, Semiconductor Manufacturing International Corp., Shanghai, China; M. Li, W. T. K. Chien, Semicoductor Manufacturing International Co., Shanghai, China; C. Niou, Semiconductor Manufacturing International (Beijing) Corp, Beijing, China

Summary: In this work, wafer bump growth mechanism was discussed. And microstructure of wafer bump nodule was analyzed by FIB, SEM and EDS.Solution of preventing wafer bump nodule growth was advanced.