M. Zhang, Semiconductor Manufacturing International Corperation, Shanghai, China; S. Liao, R. Chen, K. Chien, Semicoductor Manufacturing International Co., Shanghai, China; S. Liang, C. Niou, Semiconductor Manufacturing International (Beijing) Corp, Beijing, China; R. Lou, Semiconductor Manufacturing International Corporation(SMIC), Shang Hai, China

Summary: In this paper, one package level reliability test failure analysis case was studied, and some experiments were done to get the root cause. From the result, one model of “Slice defect” is proposed, and multiple experiment data are shown as evidences to confirm the result.