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Session 17: Analytical Process | ||||
Location: Ballroom B (Renaissance Austin Hotel) | ||||
(Please check final room assignments on-site). | ||||
Session Description: The Analytical Process Session will present papers dealing with procedures and techniques used in failure analysis, focusing on the aspects of the investigation. Papers include an analysis of the geometries of a specific defect prior to selecting an elemental identification technique, a study on flash lamp annealing and accompanying root cause analysis, a package level reliability failure detailing the modeling and confirmation of a specific defect, and the investigation of a HAST failure using signature analysis. | ||||
Editor: | Mr. Brennan Davis AMD, Austin, TX | |||
Session Chair: | Mr. Brennan Davis AMD, Austin, TX | |||
1:20 PM | Buttons and Threads: Tailoring Defect Analysis | |||
1:45 PM | Marginal Deviation of Thermal Budget Bring Shallow Junction Formation Failure Forth Study | |||
2:10 PM | Metal Slice Defect Induced Package Level Reliability Failure | |||
2:35 PM | Vanishing TiN ARC Coating as an Indicator of EOS in Aluminum Top Metal Lines |