S. Leinert, N. Martin, D. Breuer, Qimonda Dresden GmbH Co. OHG, Dresden, Germany; S. Jansen, Qimonda Dresden GmbH Co. OHG, Dresden, Germany; W. Werner, Qimonda Dresden GmbH & Co. OHG, Dresden, Germany

Summary: Analysis methods, such us solder etching, FIB and TEM imaging, for damage or material analysis in solder joints of FBGA packages are presented. The methods allow a more in depth analysis or result in a clearer idea about the situation especially concerning the intermetallic compound formation at the solder ball - pad - interface.