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Thursday, November 16, 2006 - 8:25 AM

A Novel Method for Deep Trench Profile Characterization and Process Monitoring in 90nm DRAM Technology

K. H. Huang, W. L. Gu, M. D. Liu, Y. S. Wang, J. D. Russell, Inotera Memories, Inc., Taoyuan, Taiwan

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Summary: This method of top-down polishing by pre-tilt angle provides more information compared with traditional cross-section cleaving or top-down polishing. It not only provides precise and varied DT depth structure information, but can also through continuous DT shape measurement, provide accurate data for DT capacitor simulation compared with other methods.