J. C. P. McKeon, Sonix Inc., Springfield, VA; S. L. Tan, Texas Instruments Malaysia Sdn Bhd, Kuala Lumpur, Malaysia; H. S. Jang, Sonix Inc., Seoul, South Korea

Summary: This paper will discuss the delamination detection capability of SAM and cross sectioning / SEM for encapsulated packages. The techniques required and limitations of each tool will also be discussed.