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Thursday, November 16, 2006 - 11:35 AM

NBTI Reliability of Strained SOI MOSFETs

G. Thareja, J. Lee, F. Zhu, University of Texas at Austin, Austin, TX; A. V. Y. Thean, V. Vartanian, B. Y. Nguyen, Freescale Semiconductor Inc., Austin, TX

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Summary: We investigated the degradation of device reliability due to Negative Bias Temperature Instability (NBTI) of PMOSFET on Strained Silicon on Insulator (S-SOI) substrates for the first time. The degradation has been found to be significantly higher for the S-SOI devices in comparison to SOI counterparts. Subsequent to a Constant Voltage Stress (CVS) during NBTI measurements, a negligible change in the subthreshold swing values has been observed. Thus it is believed that generation of fixed charge is responsible for the observed BTI shift in Threshold voltage (VTH) and transconductance (GM). Also higher BTI degradation was recorded for short channel devices.