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Thursday, November 16, 2006 - 4:30 PM
Measurement Techniques for Thermally Induced Warpage to Predict Ball Grid Array Package-on-Package Solder Compatibility
T. B. Davis, T. Krawzak, M. Morrison, J. Reeder, T. Jiang, Micron Technology, Boise, ID
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Summary:
Discusses sample preperation, warpage measurement, data colletion, and mathmatical usage of data to determine solderability for package on package ball grid array parts.
