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Wednesday, November 15, 2006 - 10:20 AM

Intermittent Failures in High Pin Count Packaging

R. Varma, R. Brooks, R. Twist, J. Arnold, Northrop Grumman Corporation, Linthicum, MD; C. Messick, Northrop Grumman Corporation, Clearfield, UT

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Summary: Qualification testing must include decapsulation and wire pull before declaring a part reliable. Fuming Nitric can be used to decapsulate the part, but care must be taken to expose the same amount of wire as measured from the bond pad. FIB, Auger and intermittent testing analysis are useful in verifying wire pull failures.