The Chip Scale Package (CSP) is ideal for applications like Cellular and Portable devices, and is widely used for memory device packaging. It has advantages of low package profile, easy routing and superior reliability. However, it also creates more challenges relative to failure analysis and device debugging. This tutorial will describe the unique failure analysis techniques used for these special types of packages. It covers both mechanical and chemical ways to successfully decapsulate the CSP including Multi-Chip Package (MCP), a more advanced CSP used for their reliability advantages in special package structures. You will gain and understanding of the challenges that CSPs create for device handling during failure analysis and device debugging, and learn special decapsulation techniques that are required for this special type of packaging (especially for MCP packages with stacking dices).