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Sunday, November 12, 2006 | ||
8:15 AM-12:00 PM | ||
Device and Memory FA | ||
FA Basics | ||
8:15 AM-2:45 PM | ||
Packaging | ||
1:00 PM-3:30 PM | ||
Failure Mechanisms | ||
1:00 PM-6:45 PM | ||
Microscopy Tools | ||
2:45 PM-6:45 PM | ||
EOS/ESD | ||
3:45 PM-6:45 PM | ||
Emerging Technologies | ||
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Monday, November 13, 2006 | ||
8:00 AM-9:00 AM | ||
Yield | ||
8:00 AM-10:15 AM | ||
Focused Ion Beam | ||
8:00 AM-4:15 PM | ||
Test and Logic Diagnostics | ||
9:00 AM-6:15 PM | ||
Fault Isolation | ||
10:30 AM-3:00 PM | ||
MEMS Devices | ||
3:15 PM-4:45 PM | ||
Lead Free Packaging | ||
4:15 PM-6:15 PM | ||
Lab Management | ||
4:45 PM-6:15 PM | ||
Materials Characterization |