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| Packaging | ||||
| Location: Wedgewood Room (Renaissance Austin Hotel) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chair: | Ms. Becky Holdford Texas Instruments, Dallas, TX | |||
| 8:15 AM | Enhanced De-Packaging and Chip Access FA Techniques | |||
| 9:15 AM | Chip Scale Package and Its Failure Analysis Challenges | |||
| 10:15 AM | Refreshment Break | |||
| 10:30 AM | Repackaging Complex Devices for Failure Analysis | |||
| 11:15 AM | X-Ray & SAM Challenges for IC Package Inspection | |||
| 12:00 PM | Lunch Break | |||
| 1:00 PM | Time Domain Reflectometry | |||
| 1:45 PM | Magnetic Based Current Imaging for Fault Isolation in Die and Packages | |||