|
||||
| Back to "Symposium" Search | Back to Main Search | |||
| Session 8: Discretes, Passives, MEMS, and Optoelectronics | ||||
| Location: Ballroom B (Renaissance Austin Hotel) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Failure analysis of discrete and passive devices focuses clearly on subtle details in symptoms and underlying physics. Meaningful conclusions and corrective action require an understanding of mechanisms deeper than is possible in most IC failure analysis. This session addresses challenges of basic semiconductor failure analysis and new problems associated with MEMS devices. MEMS present unique challenges in evaluation, testing, and failure analysis. Papers in this session add insight to a wide range of reliability and failure analysis issues. | ||||
| Editor: | Mr. David Burgess Accelerated Analysis, Half Moon Bay, CA | |||
| Session Chair: | Mr. David L. Burgess Accelerated Analysis, Half Moon Bay, CA | |||
| 10:20 AM | Inductive Operation Life Stress Metal Breakdown Mechanism | |||
| 10:45 AM | Root Cause Finding of a Diode Leakage Failure using Scanning Magnetic Microscopy and ToF-SIMS as Key Methods | |||
| 11:10 AM | Temperature and Humidity Dependent Reliability Analysis of RGB LED Chip | |||
| 11:35 AM | A Study of Low Leakage Failure Mechanism of X7R Multiple Layer Ceramic Capacitor (MLCC) | |||
| 12:00 PM | A System for Electro-Mechanical Reliability Testing of MEMS Devices | |||