C. C. Flores, Intel Technology Philippines, Inc., Cavite, Philippines; F. B. Aspera, Intel Technology Philippines, Cavite, Philippines

Summary: As the number of dice stacked within a microelectronic package increases, the need to maintain die surface integrity also increases. In this paper, one assembly-related rootcause mechanism causing passivation-metal damage (PMD) will be featured. The profile of inter-die adhesive was found to play an important role to maintain the integrity of die surface as more dice are being stacked in a microelectronic package. Recommended solution to prevent this type of failure will be discussed also.