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| Session 7: Package and Assembly Level FA 1 | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Dr. Deepak Goyal Intel Corporation, Chandler, AZ Ms Zezhong Fu Intel Corporation, Chandler, AZ | |||
| 10:20 AM | Al Pad Corrosion Mechanism Study when Dicing Saw | |||
| 10:45 AM | Effect of Inter-die Adhesive Profile on the Integrity of Die Surface in Die Stacking Package | |||
| 11:10 AM | Effect of Die Chip-outs and Reflow Temperature on the Mechanical Behavior of a 5-Die-Stacked Chip Scale Package | |||
| 11:35 AM | Study of FBGA Burn Failure under THB Test | |||