Y. N. Hua, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore; S. P. Zhao, Chartered Semiconductor Mfg Ltd., Singapore, Singapore; A. Trigg, Institute of Microelectronics, Singapore, Singapore

Summary: In this paper, a concept and theoretical model of galvanic corrosion (Al-Ti cell) will be proposed originally, which can help us to understand physically & chemically mechanism of galvanic corrosion at bondpad edge, and allow us to eliminate it to reduce NSOP (non-stick on pads) issue at assembly processes