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| Session 9: Package and Assembly Level FA 2 | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Dr. Deepak Goyal Intel Corporation, Chandler, AZ Ms Zezhong Fu Intel Corporation, Chandler, AZ | |||
| 4:00 PM | Studies of Galvanic Corrosion (Al-Ti Cell) on Microchip Al Bondpads and Elimination Solutions | |||
| 4:25 PM | Construction of a 3-D Current Path using Magnetic Current Imaging | |||
| 4:50 PM | Investigation of Bond-Pad Etching Chemistries for Determination of Probe/Bonding Related Sub-pad Cracks | |||