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Wednesday, November 7, 2007

STI Punch-Through Degradation Related Standby Current Failure in HTOL Test-A-Case Study

W. R. Chen, L. K. Kuo, Macronix International Co., Ltd., Hsin-chu, Taiwan

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Summary: This report summarizes the analysis results of 0.13µm technology 256Mbits NBit HTOL induced standby current failures caused by STI(Shallow Trench Isolation) punch through induced leakage degradation. Electrical analysis, EMMI and stress experiment on test devices are employed to identify the failure mechanisms, root causes, and corrective solutions. From this study, improvements could be achieved by circuit layout modification.