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Session 8: Posters
Location: Exhibit Hall 3 (San Jose McEnery Convention Center)
(Please check final room assignments on-site).
Session Description:
Session Chairs:	Mr. Kendall Scott Wills Independent Consultant, Sugar Land, TX Ms. Reena Chanpura Texas Instruments, Stafford, TX
		Study of a Systematic Low DPPM Reliability Defect Without Common Electrical Signature
		Laser Assisted Lock-in Phase & Spectral Analysis Techniques at Advanced IC Failure Analysis with Application to Jitter and Soft-Defects
		Localization of Cu/Low-K Interconnect Reliability Defects by Pulsed Laser Induced Technique
		Ultra Low Voltage Probing on 45 nm CMOS by Time Resolved Emission (TRE) Technology
		Masking Technique to Enable Multiple Site Defect Analysis on a Microchip
		The Ion Beam Imaging Methodology of Invisible Metal Under Insulator Using High Energy Electron Beam Charging
		A Case Study of Defects Due to Process-Design Interaction in Nano Scale Technology
		STI Punch-Through Degradation Related Standby Current Failure in HTOL Test-A-Case Study
		Bevel Etching: A Low Cost Alternative fo FIB
		Evaluation of Cross-Sectional Sample Preparation Techniques for 2D Doping Profiling of Specific Site by SCM
		The Failure Site Localization Using Absorbed Electron Image and Voltage Distribution Contrast
		A Simple Adapter for Soft Defect Localization using OBIRCH