J. J. Demarest, IBM, Albany, NY; A. Dalton, IBM Systems & Technology, Hopewell Junction, NY; L. Hahn, B. Redder, F. Wallingford, IBM, Hopewell Junction, NY; D. Bearup, Clarkson University, Potsdam, NY

Summary: Due to shrinking dimensions in semiconductor technology (65 nm and smaller) it is now possible to use an electron beam as a materials sensor making it possible to image subsurface voids due to less electron signal when compared to a reference site. As a consequence a 3D representation of a subsurface void can be obtained prior to cross sectioning.