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| Session 6: In-line Metrology and Inspection | ||||
| Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chair: | Ms. Janet Teshima FEI Company, Hillsboro, OR | |||
| 10:20 AM | Real-Time FTIR Etch Depth Measurements in Passive Integrated Silicon Substrates | |||
| 10:45 AM | Blind Deconvolution of SEM Images | |||
| 11:10 AM | Nondestructive Defect Imaging through Image Intensity Analysis | |||
| 11:35 AM | Automated TEM Sample Preparation on Wafer Level for Meterology and Process control | |||
| 12:00 PM | Applications of Electron Tomography on Advanced DRAM | |||