B. Seidl, J. Walter, M. Kirchberger, Infineon Technologies AG, Regensburg, Germany

Summary: The aim of the presented poster is to introduce a time and cost efficient preparation technique for FESEM investigations with focus on typical issues in electronic packaging development and failure analysis. The new ion beam based technique acts as a low cost alternative to FIB, able to prepare much wider section areas, combined in a tool, which can also be used for standard ion beam polishing processes.