B. Rijpers, ASML, Veldhoven, Netherlands; D. Verkleij, FEI, Eindhoven, Netherlands; E. Langer, GLOBALFOUNDRIES, Dresden, Germany

Summary: Using TEM for process control is a challenge because a high level of automation is needed to be able to gather statistically valid cross section metrology data with short cycle times. We have developed a method to do this for both photoresist and etched gates and we will show the roadmap towards TEM based statistically valid process control (APC).