Cost effective packaging and robust reliability are two critical factors for successful commercialization of MEMS and Microsystems technologies. In a broader and realistic sense, microsystems packaging includes assembly of components, and the testing of the finished products. The term APT for “assembly, packaging and testing” is thus a more appropriate description of the scope of “packaging” of microsystems. While APT contributes to the effective production cost of MEMS devices, reliability addresses consumer's confidence in and expectation on sustainable performance of the products.