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| Session 11: Package and Assembly Level FA 3 | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Dr. Deepak Goyal Intel Corporation, Chandler, AZ Ms Zezhong Fu Intel Corporation, Chandler, AZ | |||
| 9:50 AM | Localized Die Metallization Damage Induced during Laser-marking of a Semiconductor Package | |||
| 10:15 AM | A Novel Technique for Determining the Location of a Hermetic Leak in a ‘Metal Can' (TO-x) Package | |||
| 10:40 AM | BGA Package Level Failures Due to Contamination | |||