The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM
Back to "Session 7: Posters" Search
  Back to "Symposium" Search  Back to Main Search

Wednesday, November 18, 2009

Interconnect Immobilization Process for Failure Analysis

J. Schuchman, J. K. Willis, Intel Corporation, Hillsboro, OR

View in WORD format

Summary: The poster presents a sample preparation methodology called epoxy freeze technique for failure analysis intermittent dimm connector memory problems at Printed Circuit Board Assembly level.