The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM
 Back to "Symposium" SearchBack to Main Search
Session 7: Posters
Location: Exhibit Hall 3 (San Jose McEnery Convention Center)
(Please check final room assignments on-site).
Session Description: Case studies and other work that is best presented in a static fashion. Authors attending ISTFA should stand by their posters during the session to answer questions and stimulate discussion of their material.

Session Chair:Mr. Kendall Scott Wills Independent Consultant, Sugar Land, TX
 Writing Better Research Reports
 A New Failure Analysis Flow of Gate Oxide Integrity Failure in Wafer Fabrication
 Instrumental Discrepancy and Relation of Stress Condition
 Doping Profile Inspected by SEM Dopant Contrast, Wet Stain and SCM
 Case Study: Failure Analysis of Functional Shmoo Hole with Laser Voltage Probing
 In Situ Polyimide Removal Using Modified Decapsulator
 The Mechanism and Application of Surface Effect On e-Beam Voltage Contrast and Dopant Contrast
 Back-End-of-Line Quadrature-Clocked Voltage-Dependent Capacitance Measurements
 The Novel TEM Sample Preparation Approach for Targeted Via with Barrier/Cu Seed Layer Inspection
 Decapsulation Techniques for Cu Wire Bonding Package
 Evaluation Trial of MEMS Devices by LSI Process Diagnostics
 A Novel Technique of Device Measurement After Cross-Sectional FIB in Failure Analysis
 Effectiveness of Nanoprober in Detecting Single / Multiple Bit Flash Data Gain & Data Loss Failures
 Interconnect Immobilization Process for Failure Analysis
 EFFECTIVENESS of Non Destructive Physical Analysis Method Using X-Ray CT Imaging
 Failure Analysis Investigation Leading to a Yield Enhancement On the Production Units
 Fail Mechanisms Causing Single Bit Flash Data Gain in Flash Memory