The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM

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Thursday, November 19, 2009 - 8:50 AM

Development of Laser-Based Variation Mapping Techniques – Another Way to Increase the Successful Analysis Rate On Analog & Mixed-Mode ICs

M. A. Sienkiewicz, CNES (French Space Agency) (& Freescale Semiconductor), Toulouse, France; K. Sanchez, P. Perdu, CNES - French Space Agency, Toulouse, France; L. Cattaneo, CNES, Toulouse, France; A. Firiti, Freescale Semiconductor, Toulouse, France; O. Crepel, Freescale Semiconductor SAS, Toulouse, France; D. Lewis, IXL laboratory, Talence, France

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Summary: The failure localization on analog & mixed mode ICs in functional mode (AC signals) has became challenging in the last few years. Due to an increasing integration, and therefore of the complexity of these devices, the number of defects, especially those named “soft”, raised considerably. An experience with the classical Dynamic Laser Stimulation techniques showed some limitations when applied to analog & mixed-mode devices. The SDL (Soft Defect Localization) technique based on two state output signals allows us to localize only the most sensitive devices. The defect in this type of circuits, which are very sensitive to the laser beam, is often characterized by a weaker sensitivity than that of “healthy” regions. Hence, xVM (Variation Mapping) techniques were introduced to map some parameters in analog way (different sensitivity levels are visualized). To date, the Delay and the Phase Variation Mapping techniques were published. We have already had some interesting results by using these techniques but not every “soft” defect case study could be resolved in that way. In this abstract we propose to look at the different parameters which characterize an analog signal and can be used as an input for the laser mapping. By applying a simple setup, without any additional sophisticated tool, we will show on a “golden” commercial device the added value of this analysis. Moreover, we will discuss its advantages and drawbacks.