S. L. Toh, E. Hendarto, J. Sudijono, P. K. Tan, Y. W. Goh, H. B. Lin, Q. Deng, H. Tan, L. Zhu, Q. F. Wang, H. L. Li, R. He, J. Lam, Z. H. Mai, Chartered Semiconductor Manufacturing Pte. Ltd., Singapore, Singapore

Summary: The methodology and challenges facing failure analysis in the detection of leakage current in devices were discussed. New "packaging" failure analysis methodology was proposed to help in the detection of leaky site for devices with smaller physical feature sizes.