 |
The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM |
| Back to "Symposium" Search | Back to Main Search | |||
| Session 10: Failure Analysis Process | ||||
| Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: The Failure Analysis Process session outlines a specific failure analysis process and introduces novel findings or procedures in failure analysis. | ||||
| Session Chair: | Mr. Jim Colvin FA Instruments, San Jose, CA | |||
| 10:15 AM | Failure Analysis of Stacked-Die Devices by Combining Non-Destructive Localization- and Target Preparation Methods | |||
| 10:40 AM | Challenges Facing the Detection of Leakage Current in Integrated Circuit (IC) Devices | |||
| 11:05 AM | Analysis of a Media Processor Functional Failure | |||