The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM
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Wednesday, November 18, 2009 - 8:00 AM

Global Die Ultra-Thin Silicon for Backside Diagnostics and Circuit Edit

E. O'Donnell, D. Scott, Intel Corporation, Folsom, CA

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Summary: Paper will discuss how to achieve a uniform silicon thickness of 10um across an entire silicon sample to enable circuit edit and optical probing applications. Paper will further discuss the advantages of this approach and how previous concerns of mechanical instability and thermal management have been resolved.