A. Deyine, THALES & CNES (French Space Agency) laboratory, Toulouse, France

Summary: Laser stimulation techniques are currently used in semiconductor device failure analysis in addition to electrical tests in order to localize defects in a device. The failure analysis in integrated circuit becomes more and more complex since electronic component integration increases. We propose to add a dimension in the dynamic analysis of integrated circuit: the time when the failure occurs. We present a new Dynamic Laser Stimulation technique involving a tester which controls the laser power (modulation, on and off), the laser position on the device and the device itself. Defects localization and electrical tests can be coupled to discriminate defects and to provide more useful information about the failure. It is the latest evolution of optical technique to provide more accurate analysis with a single set up: the Full Dynamic Laser Stimulation.