The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM

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Thursday, November 19, 2009 - 8:25 AM

Degradation Analysis of Thick Film Chip Resistors

B. P. Sood, D. Das, M. H. Azarian, M. Pecht, CALCE, University of Maryland, College Park, MD

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Summary: Negative resistance drift in thick film chip resistors at high temperature and high humidity application conditions was investigated. The paper reports investigation of possible causes including current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim and, possibility of silver migration or copper dendrites formation.