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The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM |
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| Session 9: Package and Assembly Level FA | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Analysis of failures and materials used in wafer saw and package assembly of IC's | ||||
| Session Chair: | Mr. James Demarest IBM, Poughkeepsie, NY | |||
| 8:00 AM | Studies On A Qualification Method (OSAT) of Microchip Al Bondpads in Wafer Fabrication | |||
| 8:25 AM | Degradation Analysis of Thick Film Chip Resistors | |||
| 8:50 AM | Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants | |||
| 9:15 AM | Driving Fracture Mechanisms for Ground Silicon Dice | |||
| 9:40 AM | Ultimate Resolution for Current Localization by Means of Magnetic Techniques | |||