L. Meng, J. C. H. Phang, Centre for Integrated Circuit Failure Analysis and Reliability (CICFAR), National University of Singapore, Singapore, Singapore; A. G. Street, inscopelabs, Singapore

Summary: Scanning Electron Acoustic Microscopy has been used to generate high-resolution images of subsurface features at different depths in multi-level integrated circuits. Significant improvements in SEAM contrast, spatial resolution and depth discrimination have been demonstrated.