The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM
Back to "Microscopy" Search
  Back to "Tutorial" Search  Back to Main Search

Monday, November 16, 2009 - 8:15 AM

X-Ray & SAM Challenges for IC Package Inspection

T. M. Moore, C. Hartfield, Omniprobe, Inc., Dallas, TX; G. Samuelson, Translational Genomic Institute, Phoenix, AZ