35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): The Novel TEM Sample Preparation Approach for Targeted Via with Barrier/Cu Seed Layer Inspection

The Novel TEM Sample Preparation Approach for Targeted Via with Barrier/Cu Seed Layer Inspection

Wednesday, November 18, 2009

Exhibit Hall 3 (San Jose McEnery Convention Center)

Dr. Wen Fei Hsieh , UMC, Tainan County, Taiwan

Mr. Shih-Hsiang Tseng , UMC, Tainan County, Taiwan

Mr. Bo Min She , UMC, Tainan County, Taiwan

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See more of: Session 7: Posters
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