35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): A Novel Technique of Device Measurement After Cross-Sectional FIB in Failure Analysis

Wednesday, November 18, 2009

Exhibit Hall 3 (San Jose McEnery Convention Center)

Mr. Chih-Chung Chang , UMC, Tainan, Taiwan

Mr. Jian-Chang Lin , United Microelectronics Corporation, Hsin-Chu, Taiwan

Mr. Wen Sheng Wu , United Microelectronics Corporation, Ltd., Tainan County, Taiwan

Mr. Chin-Lin Chang , UMC, Tainan, Taiwan

Chih Yang Tsai , UMC, Tainan County, Taiwan

See more of: Session 7: Posters
See more of: Symposium