35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Studies On A Qualification Method (OSAT) of Microchip Al Bondpads in Wafer Fabrication

Start | Browse by Day | Author Index

Studies On A Qualification Method (OSAT) of Microchip Al Bondpads in Wafer Fabrication

Thursday, November 19, 2009: 8:00 AM
Meeting Room J3 (San Jose McEnery Convention Center)
Dr. Rao Ramesh , Chartered Semiconductor Mfg Ltd, Singapore, Singapore
Mr. Hua Younan , Chartered Semiconductor Mfg Ltd, Singapore, Singapore
View in PDF format
See more of: Session 9: Package and Assembly Level FA
See more of: Symposium