35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Session 9: Package and Assembly Level FA

Thursday, November 19, 2009: 8:00 AM-10:05 AM

Meeting Room J3 (San Jose McEnery Convention Center)

Session Chair:

Mr. James Demarest

8:00 AM

Studies On A Qualification Method (OSAT) of Microchip Al Bondpads in Wafer Fabrication
Dr. Rao Ramesh , Chartered Semiconductor Mfg Ltd; Mr. Hua Younan, Chartered Semiconductor Mfg Ltd

8:25 AM

Degradation Analysis of Thick Film Chip Resistors
Mr. Bhanu P. Sood, CALCE, University of Maryland; Diganta Das, CALCE, University of Maryland; Michael H. Azarian, CALCE, University of Maryland; Michael Pecht, CALCE, University of Maryland

8:50 AM

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants
Mr. Bhanu P. Sood, CALCE, University of Maryland; Michael Pecht, CALCE, University of Maryland

9:15 AM

Driving Fracture Mechanisms for Ground Silicon Dice
Dr. Roberto Dugnani, Exponent Failure Analysis Associates; Dr. Ming Wu, Exponent Failure Analysis Associates

9:40 AM

Ultimate Resolution for Current Localization by Means of Magnetic Techniques
Mr. Fulvio Infante, Centre Nationale d'Etudes Spatiales (CNES); P. Perdu, CNES-French Space Agency; Dean Lewis, IXL laboratory

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